eYs3D Microelectronics is a fabless semiconductor design house that designs processors and 3D sensory systems for vision AI at the edge. With operations in Taiwan and the United States, and a sales office in Shenzhen, China, the company has had a very successful history of providing ICs and silicon-centric stereo vision 3D sensing as well as ISP products to the market. After closing its Series A strategic investment from ARM IoT Fund, WI Harper, Marubun Corporation, and Sunplus Technology, the company has expanded its focus in design approach and market reach.
The company embodies algorithms that integrate and manage information from multiple sensor sources, including physical sensors, active 3D sensing, and neural network computation. This “sensor fusion” approach enables the design of systems for applications incorporating visual simultaneous location and mapping (viSLAM), object feature depth recognition, and gesture-based commands. Targeting smart sensory IoT devices and consumer/industrial robotics, eYs3D strives to become the new leader in intelligent computer vision processors.